LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach
LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
- Hydrophobic
- Electrically conductive
- Thermally conductive
- Stable at high temperatures
- High die shear strength